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Keywords: stress
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040802.
Paper No: EP-18-1117
Published Online: May 17, 2019
...; published online May 17, 2019. Assoc. Editor: Tse Eric Wong. 18 12 2018 27 03 2019 solder joint fatigue reliability stress strain creep The electronic packaging industry is one of the largest industries in the world [ 1 ]. The role of solder in the electronic packaging has...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021006.
Paper No: EP-14-1025
Published Online: June 1, 2015
...Fei Su; Zheng Zhang; Yuan Wang; Weijia Li The creep rate of the SAC solder is low at room temperature (e.g., 10 −8 /s under a uniaxial stress of 10 MPa [ 16 ]); therefore, linear elasticity is regarded as the intrinsic mechanical property of the SAC solder to simplify the subsequent development...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
Published Online: August 24, 2006
...Päivi H. Karjalainen; Pekka Heino New packaging materials make it possible to produce flexible system in package (SIP) and system on package (SOP) modules. However, in these the integrated circuits are exposed to increased mechanical stresses. The stresses may become even more severe when thinned...
