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Keywords: soldering, intermetallic
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
Published Online: October 6, 2014
... angle with respect to the nano-indentation loading direction show higher elastic modulus (∼8.70% higher) and hardness (8.85% higher) compared to the grains that have a c -axis that is almost perpendicular to the nano-indentation loading direction. soldering, intermetallic mechanical properties...
