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Keywords: skin effect
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021004.
Paper No: EP-24-1071
Published Online: December 20, 2024
... during signal integrity (SI) analysis of a chip package. Thus, this paper presents a π-type equivalent circuit model for a signal TCV in steady of the full-wave 3D model. To improve model accuracy, the model takes into account the parasitic inductance and resistance induced by the skin effect of TCV...
