..., it is found that the effects of variation in substrate material properties are negligible. bronze heat transfer microchannel flow nitrogen silicon compounds slip flow thermal conductivity thermal management (packaging) conjugate uniform heat flux gas slip flow long microchannel...

... output only about 3% lower than that of the FTWL package. electronics packaging light emitting diodes phosphors silicon compounds light emitting diode correlated color temperature color-rendering index total internal reflection lumens Optical power as a function of phosphor weight...

... diffusion barriers electron spectroscopy electronics packaging metallisation silicon compounds thermal conductivity thermal expansion tungsten compounds X-ray diffraction In recent years, several research groups have reported that refractory metal barrier layers show more promise in preventing...

... in T g . 22 12 2007 26 09 2008 13 02 2009 electronics packaging finite element analysis shrinkage silicon compounds epoxy molding compound FEA bimaterial model thermal expansion coefficient chemical cure shrinkage silica filler percentage Some...

.... delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment 25 07 2005 19 03 2008 17 11 2008 Underfill materials are used in flip chip...

... 2006 04 04 2007 ceramics conducting polymers crushing dielectric losses electronics packaging encapsulation filled polymers particle size permittivity sieving silicon compounds thermal conductivity thermal conductivity polymer composite ceramic filler dielectric...

... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...

..., 2004. Review conducted by: Y. C. Chan. 13 January 2004 23 June 2004 03 06 2005 silicon compounds flip-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion...

... the fabricated microchannel. silicon compounds alumina microfluidics micromachining channel flow electrophoresis osmosis numerical analysis mixing Recent progress of the surface micromachining technology expands the frontier of engineering applications. Some of them include...

.... 11 January 2000 silicon compounds filled polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding...