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Keywords: reliability test
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
Published Online: September 13, 2021
..., silicone gel, and epoxy, are utilized. The IMS-type module with silicone gel molding fails the temperature cycling test (TCT) with the delamination of the solder layer. The module with epoxy successfully passes the automotive-grade reliability tests, including TCT, highly accelerated stress test, high...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...
