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Keywords: power electronics
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
Published Online: November 23, 2022
... thermal conductivities of 6.0 and 8.5 W/m K. HALT specimens were prepared by applying TIM through a 4-mil stencil over AlSiC baseplates in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples...
Includes: Supplementary data
Journal Articles
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
Published Online: October 22, 2022
... with Standards such as Joint Electron Device Engineering Council (JEDEC) and Institute for Printed Circuits (IPC) is to the best of our knowledge lacking. To fill this gap, a detailed review of failure mechanism driven reliability models, with emphasis on physics of failure (PoF) for power electronics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041111.
Paper No: EP-21-1103
Published Online: November 5, 2021
...Justin Hollis; Darin J. Sharar; Todd Bandhauer High-temperature silicon carbide (SiC) die are the most critical and expensive component in electric vehicle (EV) power electronics (PE) packages and require both active and passive methods to dissipate heat during transient operation. The use of phase...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
Published Online: July 10, 2020
... scattering in the tested HVPE-grown bulk GaN substrates. The results provide useful information for designing thermal management solutions for vertical GaN power electronic devices. e-mail:  sukwon.choi@psu.edu 13 01 2020 02 06 2020 10 07 2020 gallium nitride (GaN) power...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
Published Online: June 26, 2020
... in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031113.
Paper No: EP-20-1012
Published Online: May 21, 2020
... (GaN) with an aim to accomplish an improvement in size, weight, and power of power electronics beyond current devices based on silicon (Si). However, the increased operating power densities and reduced areal footprints of WBG device technologies result in significant levels of self-heating that can...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011003.
Paper No: EP-19-1014
Published Online: September 19, 2019
.... Fig. 11 Exploded view of the laminated foil TLP bonding fixture plus assembly (left) and actual fabrication setup (right) e-mail:  yanghe.liu@toyota.com 04 02 2019 26 07 2019 19 09 2019 transient liquid phase high-temperature bond wide band-gap power electronics...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031012.
Paper No: EP-18-1098
Published Online: June 17, 2019
...Alexander Otto; Sven Rzepka; Bernhard Wunderle Active power cycling (APC) is a standardized and well-established method for reliability assessment and product qualification in power electronics (PEs) technologies. Repetitive pulses of load current are applied to cause cyclic thermal swings in the p...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
Published Online: May 8, 2019
...Darshan G. Pahinkar; Lauren Boteler; Dimeji Ibitayo; Sreekant Narumanchi; Paul Paret; Douglas DeVoto; Joshua Major; Samuel Graham With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011005.
Published Online: March 9, 2011
...Paolo Emilio Bagnoli; Cristina Padovani; Andrea Pagni; Giuseppe Pasquinelli The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
...Manu Mital; Elaine P. Scott This paper presents a thermal design methodology for an integrated power electronic module (IPEM) using embedded, single-phase, and laminar-flow rectangular microchannels. Three-dimensional packaging of electronic components in a small and compact volume makes thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 1–8.
Published Online: April 16, 2006
...Y. Pang; E. Scott; J. D. van Wyk; Z. Liang The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 388–397.
Published Online: December 21, 2005
...J. Dirker; J. D. van Wyk; J. P. Meyer Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future developments such as three-dimensional integration. This paper...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
Published Online: January 24, 2005
...M. Herna´ndez-Mora; J. E. Gonza´lez; M. Ve´lez-Reyes; J. M. Ortiz-Rodrı´guez; Y. Pang; E. Scott Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... and Systems, Reno, Nevada . Ye , H. , Lin , M. , and Basaran , C. , 2002 , “ Failure Modes and FEM Analysis of Power Electronic Packaging ,” Finite Elem. Anal. Design 0168-874X , 38 ( 7 ), pp. 601 – 612 . Ye , H. , Basaran , C. , and Hopkins , D. , 2003...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 211–217.
Published Online: October 1, 2000
...A. G. Evans; M. Y. He; J. W. Hutchinson; M. Shaw A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 323–327.
Published Online: November 25, 1999
... received by the EEPD Division November 25, 1999. Associate Technical Editor: Y. Joshi. 25 November 1999 thermal management (packaging) surface mount technology thermal resistance magnetic devices power electronics In the present microelectronics industrial revolution, designers...