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Keywords: power bipolar transistors
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031012.
Published Online: September 30, 2010
... . 10.1016/j.microrel.2007.08.008 29 11 2009 08 08 2010 30 09 2010 30 09 2010 cracks fracture mechanics insulated gate bipolar transistors lead bonding power bipolar transistors semiconductor device reliability temperature distribution thermal analysis thermal stress...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044501.
Published Online: October 21, 2009
... 2008 17 09 2009 21 10 2009 cooling finite element analysis heterojunction bipolar transistors microwave power amplifiers power bipolar transistors semiconductor device models temperature distribution collector-up (C-up) finite-element model (FEM) heterojunction bipolar...
Journal Articles
J. Puigcorbe´, S. Marco, S. Leseduarte, M. Carmona, O. Vendier, C. Devron, S. L. Delage, D. Floriot, H. Blanck
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 549–555.
Published Online: December 15, 2003
... as an alternative in the field of GaAs heterojunction transistors. The technological and electrical advantages are reviewed in Ref. 1 . finite element analysis flip-chip devices lead bonding power bipolar transistors heterojunction bipolar transistors gold 01 November 2002 15 12 2003...
