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Keywords: porous materials
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
... . heat sinks cooling electronics packaging convection porous materials metal foams aluminium 25 05 2005 23 09 2005 oa e i io sen oam ] a he en ent , th co sta e a nm e epo ent o, a hou per he However, the relative enhancement is found to decrease with each additional fin...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 226–235.
Published Online: August 18, 2005
... to that with ( X L = 1.58 , n = 5 , w ∕ H = 0.6 ) because the total lengths of the baffles were similar. Effect of baffle pitch on local Nusselt number distributions in the x -direction 06 02 2005 18 08 2005 heat sinks porous materials heat transfer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 127–134.
Published Online: June 1, 2004
... in this study is an open-cell porous material that consists of a network of interconnected graphite ligaments whose thermal conductivities are up to five times higher than copper. While the bulk graphite foam has a thermal conductivity similar to aluminum, it has one-fifth the density, making it an excellent...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 223–234.
Published Online: May 8, 2004
... heat transfer augmentation in porous foam channels. For investigating the thermophysical properties, Du Plessis ( 1 ) provided a theoretical model to predict the permeability ( K ) and inertial coefficient ( C F ) of foamlike porous material with very high porosity. Antohe et al...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 155–163.
Published Online: July 26, 2002
...) forced convection thermal resistance foams porous materials flow through porous media boundary layers cooling aluminium The large-scale integration of electronic circuits has resulted in a continuous increase in chip power dissipation requirements. According to the SIA roadmap 1...