... error was reduced from 50% to 3.3% for the 36 pillar array. finite element analysis flip-chip devices optimisation A second simplification method was used to simplify the octant model to reduce the DOF and computation time while maintaining accuracy of the 3D models. The GPD model was cut...

... 30 09 2010 14 01 2011 09 03 2011 09 03 2011 arrays brightness computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) To quantify illuminance nonuniformity...

... cooling electronics packaging optimisation To address the issues of acoustic noise and energy expense associated with the use of cooling fans and to enhance operational reliability, natural convection cooling is often preferred for electronic equipment. However, the heat transfer associated...

... they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed. 05 06 2007 06 12 2007 30 07 2008 design of experiments electronic design automation electronics packaging neural nets numerical analysis optimisation...

...). 28 07 2006 05 11 2006 cooling optimisation thermal resistance thermoelectric devices thermoelectric cooler electronic cooling thermal resistance optimization methods Thermoelectric modules (TEMs) or thermoelectric coolers (TECs) are widely used for the thermal...

... and reduce the velocity. heat sinks multichip modules heat transfer thermal analysis flow simulation jets optimisation numerical analysis 11 June 2004 10 August 2004 24 01 2005 Manuscript received June 11, 2004; revision received August 10, 2004. Review conducted...

... thermal resistance gradient methods sensitivity analysis optimisation optimal thermal design pin-fin heat sink DOE CCD RSM thermal resistance pressure loss mass constraint In recent years, the heat sink has become the most common thermal management hardware in use...

.... This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level. 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks...

... 2004 integrated circuit interconnections integrated circuit packaging electroplating optimisation photolithography reliability integrated circuit reliability response surface methodology silicon thermal expansion wafer bonding The rapid advances in IC design and fabrication...

...L. J. Ernst, Guest Editor; G. Q. Zhang, Guest Editor 15 12 2003 thermal management (packaging) digital simulation optimisation micromechanical devices failure analysis This special issue includes selected papers presented at the International Conference of Thermal...

... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...

...; revised manuscript received September 14, 2000. Associate Editor: J. Lau. 30 August 1999 14 September 2000 ball grid arrays plastic packaging optimisation finite element analysis matrix decomposition circuit analysis computing printed circuit design New products...

... by the EEPD July 13, 1999; revised manuscript received February 25, 2000. Associate Technical Editor: B. Michel. 13 July 1999 25 February 2000 vibrations modal analysis supports optimisation printed circuit design In many engineering structures, one is normally interested...

... printed circuits heat transfer cooling convection optimisation printed circuit design The optimal placement of components on printed wiring boards requires satisfying multiple, possibly conflicting, design objectives. As pointed out by Moresco 1 , these design objectives may be very...