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Keywords: nano-indentation
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Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
...Fei Qin; Shuai Zhao; Yanwei Dai; Lingyun Liu; Tong An; Pei Chen; Yanpeng Gong Thermomechanical reliability assessment for sintered silver is a crucial issue as sintered silver is a promising candidate of die-attachment materials adopted for power devices. In this paper, the nano-indentation tests...
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
...: Felix Chen. 07 10 2013 29 06 2014 The elastic and plastic mechanical properties of intermetallic compound (IMC) phases of a lead-free Sn3.5Ag/Cu-substrate soldering system are investigated in different sized joints using nano-indentation. The specimens were prepared using solid...
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress