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Keywords: microassembling
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031002.
Published Online: June 16, 2009
... electronics packaging microassembling process capability analysis reliability statistical analysis die strength delamination good leadframe oxidized leadframe QFN package The advantages of copper have rapidly made it one of the main materials for the leadframes used in microelectronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 149–156.
Published Online: August 14, 2006
.... anisotropic conductive adhesive lead-free assembly thermal aging temperature-humidity aging Z bond adhesive conductive adhesives electronics packaging surface mount technology microassembling integrated circuit packaging ball grid arrays ageing contact resistance anisotropic media 04...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
Published Online: January 24, 2005
.... The results indicate good agreement (∼6% discrepancy) between the numerical model and the measurement. electronics packaging thermal resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... Thermomigration Current Stressing High Current Density Power Electronics Nanoelectronics power electronics nanoelectronics flip-chip devices soldering electromigration current density microassembling reliability 22 12 2003 15 09 2004 Lee , T. Y. , Tu , K. N...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... alloys silver alloys tin alloys solders flip-chip devices integrated circuit reliability microassembling integrated circuit packaging reflow soldering voids (solid) 12 01 2004 18 05 2004 Average void volume percentage of bump volume per defective bump as distributed by size...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
Published Online: May 4, 2004
.... 03 09 2003 04 05 2004 fracture toughness testing integrated circuit packaging internal stresses finite element analysis fracture mechanics microassembling Integrated circuit packaging has been continuously driven to miniaturization. After circuits are built on the front...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 115–119.
Published Online: April 30, 2004
.... 01 September 2003 30 04 2004 thermal stresses electronics packaging adhesion deformation microassembling The die stress, warpage of the assembly, and die attach shear and peel stresses determined from the corrected Suhir solution are compared closely with those from...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 106–109.
Published Online: April 30, 2004
... the silicon and the carrier and separation of these materials by peeling. In a more complex package, a similar failure of adhesion at other material interfaces may arise instead. microassembling delamination integrated circuit packaging 01 January 2003 01 September 2003 30 04...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 597–601.
Published Online: December 15, 2003
... 2003 fine-pitch technology soldering flip-chip devices integrated circuit interconnections integrated circuit packaging aluminium microassembling Since the inception of C4 (controlled collapse chip connection) technology by IBM for their solid logic technology (SLT) more than 40...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 392–399.
Published Online: September 17, 2003
... stress model could be developed based on the static stress simulation and fracture mechanics methodology could be applied in the model to make the simulation more accurate as well. microassembling packaging failure analysis delamination finite element analysis stress analysis adhesion voids...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 329–334.
Published Online: September 17, 2003
... 2003 bubbles reflow soldering voids (solid) surface tension viscosity flip-chip devices microassembling integrated circuit packaging The reliability of solder bumps has become more critical as the components become smaller. Figure 1 shows a typical flip-chip assembly commonly...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 105–111.
Published Online: October 20, 2000
... to maintain the electronics within the desired temperature range. Thus the best solution seems to be adoption of electronics that can withstand the entire Mars environmental temperature range. space vehicle electronics planetary rovers microassembling integrated circuit reliability integrated...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 168–171.
Published Online: March 15, 1999
... PACKAGING . Manuscript received by the EEPD March 15, 1999. Associate Technical Editor: B. Michel. 15 March 1999 ceramic packaging microassembling integrated circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic...