... 2011 14 09 2011 brittleness laminates mechanical testing shear strength solders The transition of most microelectronics products to lead free assembly has led to new challenges even for those industry sectors still exempt from the requirement to change solder alloys. The overall...

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... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...

... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...

... reliability solders mechanical testing transient analysis printed circuit testing 22 01 2006 06 06 2006 2007 American Society of Mechanical Engineers ...

... mechanical testing finite element analysis printed circuit boards (PCB) optimal support locations maximum fundamental frequency modal testing A printed circuit board (PCB) is a complex plate structure that is made primarily of fiberglass known as FR-4 and thin copper layers. In the design...

... 23 11 2005 lead bonding integrated circuit packaging integrated circuit metallisation materials testing shear deformation nucleation ductile fracture mechanical testing voids (solid) gold copper aluminium fractography shear fracture gold ball bond copper ball bond...

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... of the particle and exposing the underlying polymeric portion were also observed. 20 02 2004 14 02 2005 anisotropic media electronics packaging mechanical contact contact resistance abrasion friction mechanical testing adhesives anisotropic conductive film (ACF) mechanical shock...

... devices heat sinks design of experiments thermal stress cracking mechanical testing finite element analysis inspection 10 April 2000 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Revised manuscript received...

... circuit bonding solidification shear strength mechanical testing metallography ultrasonic materials testing acoustic microscopy 15 March 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received...