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Keywords: lead-free solder alloy
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
... The specimens used in this study were made of the lead-free solder alloy Sn–3.0Ag–0.5Cu. Cylindrical ingots of the solder alloy were machined into specimens with the geometry shown in Fig. 1 . Based on the test standard of the Society of Material Science Japan (JSMS) ( 22 ), the specimens were annealed...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021003.
Published Online: March 27, 2009
... relations tensile testing tin alloys viscoplasticity lead-free solder alloy elasto-plastic-creep constitutive model time-independent deformation time-dependent deformation One significant problem in surface mounting technology is the differences in the coefficients of thermal expansion...