... 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys This work of authorship was prepared as an account of work sponsored by an agency of the United States Government. Accordingly, the United States Government retains a nonexclusive, royalty...

... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys 2011 American Society of Mechanical Engineers ...

... roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. eutectic alloys interface phenomena lead alloys silver alloys solders surface roughness tin alloys wetting zinc alloys wetting solders...

... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys...

.... At elevated temperature, vibration and shock were found to cause the accumulation of inelastic strain and damage in solder joints, which is contrary to the popular belief that most vibration-induced strains are usually elastic. durability fatigue integrated circuit interconnections lead alloys...

... scale, which is needed for use in strain gradient plasticity type constitutive models, is determined. The value of length scale is in agreement with values available in literature for different materials like copper, nickel, and aluminum. 16 06 2005 04 10 2006 solders lead alloys tin...

... 63Sn–37Pb solder lead alloys materials properties mechanical testing soldering solders tin alloys work hardening 23 02 2006 20 07 2006 2007 American Society of Mechanical Engineers ...

... copper alloys lead alloys fractography Many factors can affect the service reliability of a solder joint ( 1 ). Solder microstructure, soldering defects, cyclic temperature range, peak temperatures, holding time, and loading/unloading rates...

... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. 06 12 2005 21 05 2006 solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys...

... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...

... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...

... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...

.... Packag. 1043-7398 10.1115/1.1876472 , 127 ( 2 ), pp. 120 – 126 . 29 06 2004 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow...

... Temperatures, Japan Society of Materials Science , pp. 116 – 120 . 17 12 2004 24 12 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between...

... printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36%Pb–2%Ag alloy area array package chips CSP ball grid array printed wiring boards An area...

.... Associate Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal conductivity thermal analysis thermal energy storage...

... based on parameters determined using the original procedure of Desai ( 1 ), and for HiSS based on the iterative parameter determination procedure developed here. 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders electronics packaging viscoelasticity...

... . 01 10 2003 26 05 2004 tin alloys lead alloys silver alloys copper alloys solders ball grid arrays printed circuit testing fatigue testing deformation soldering Electronic Packaging Ball Grid Array (BGA) Solder Joints Low Cycle Fatigue Mixed-Mode Loading Since...

... conductivity of the joints, degrade the mechanical properties and even induce crack initiation and propagation ( 2 ). The level of understanding about the formation of voids still remains speculative, and very little work has been reported on this subject in the open literature. lead alloys silver...

..., through its user defined material subroutine, UMAT. The damage coupled finite element analysis is applied to characterize monotonic tensile behavior of specimens with different microstructure sizes. The predicted results are compared with test data. solders tin alloys lead alloys fatigue...