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Keywords: laser
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
Published Online: August 17, 2020
...Sougata Hazra; Ki Wook Jung; Madhusudan Iyengar; Chris Malone; Mehdi Asheghi; Kenneth E. Goodson Laser machining is an inexpensive and fast alternative to conventional microfabrication techniques and has the capability to produce complicated three-dimensional (3D), hierarchical structures...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
Published Online: April 1, 2009
...Zongjie Han; Songbai Xue; Jianxin Wang; Xin Zhang; Shenglin Yu; Liang Zhang In this paper, soldering experiments of fine pitch quad flat package (QFP) devices were carried out when soldered with Sn–Ag–Cu and Sn–Cu–Ni lead-free solders by means of diode laser soldering system, and compared...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024501.
Published Online: May 8, 2008
...Raathai Molian; Pranav Shrotriya; Pal Molian The traditional “evaporation∕melt and blow” mechanism of C O 2 laser cutting of aluminum nitride (AlN) chip carriers and heat sinks suffers from energy losses due to its high thermal conductivity, formation of dross, decomposition to aluminum...