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1-4 of 4
Keywords: joining processes
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011007.
Published Online: March 19, 2010
... circuit packaging joining processes anisotropic conductive adhesives (ACAs) copper anti-oxidant silane coupling agent electrical contact resistance reliability Electrically conductive adhesives (ECAs) have been extensively used for interconnection and joining materials...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
Published Online: March 21, 2005
... resins self-assembly joining processes surface tension electronics packaging numerical analysis wetting 3 Mathematical models of an axisymmetric liquid joint for ( a ) the put-down model and ( b ) the pull-up model 1 The chip weight per bump, the liquid volume, and the pad...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 178–184.
Published Online: September 30, 2004
...—by manipulation of the board contour. assembling electric connectors laminates printed circuits electronics packaging joining processes 16 09 2003 30 09 2004 2005 American Society of Mechanical Engineers ...
Journal Articles
Naotaka Tanaka, Senior Researcher, Kenya Kawano, Researcher, Hideo Miura, Chief Researcher, Yoshiyuki Kado, Engineer, Ikuo Yoshida, Senior Engineer
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 82–86.
Published Online: April 30, 2004
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Nov. 2002. Associate Editor: B. Michel. 01 Nov 2002 30 04 2004 joining processes plastic deformation reliability stress relaxation electrical contacts interconnections flip-chip devices adhesives adhesion The best...
