1-1 of 1
Keywords: interfacial strength
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
DOI: https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
... 29 11 2022 11 01 2023 flexible encapsulants interfacial strength liquid encapsulation reliability of flexible hybrid electronics Encapsulants are liquid resins made up of filler particles and epoxy that are coated and cured on flexible hybrid electronics to protect...
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Click here to open pdf in another window PDF for Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver