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Keywords: integrated circuit modelling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
Published Online: September 20, 2006
... integrated circuit modelling moulding temperature distribution finite element analysis IC packaging molding process thermal stress finite element method As the integrated circuit (IC) functions develop toward more lead counts, high efficiency and high processing speed, and products become...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 335–339.
Published Online: November 3, 2004
... effect. 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs Plastic Encapsulation...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 276–285.
Published Online: August 12, 2004
.... Presented at Esime2002, Paris, April 2002. integrated circuit packaging integrated circuit interconnections integrated circuit modelling integrated circuit reliability integrated circuit testing finite element analysis indentation viscoelasticity dielectric materials polymer films thin...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 262–267.
Published Online: June 26, 2004
... of the vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 498–505.
Published Online: December 15, 2003
... to 7×7 area array of solder joints at a 0.5 mm pitch (Fig. 1 ). The chip thickness is 0.68 mm. The pads on the silicon chip are solder mask defined (SMD) and have a diameter of 0.28 mm. integrated circuit reliability chip scale packaging integrated circuit modelling tolerance analysis...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 589–596.
Published Online: December 15, 2003
... gallium arsenide power amplifiers radiofrequency amplifiers MESFET integrated circuits field effect analogue integrated circuits integrated circuit packaging high-temperature electronics lead bonding thermal resistance thermal conductivity integrated circuit modelling integrated circuit...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 576–581.
Published Online: December 15, 2003
... packaging soldering fatigue integrated circuit reliability integrated circuit modelling 01 November 2002 15 12 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2002. Associate...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 354–361.
Published Online: September 17, 2003
... (packaging) integrated circuit packaging jets heat transfer pulsatile flow thermal analysis integrated circuit modelling cooling numerical analysis Jet impingement cooling of chips is an attractive option due to the high heat transfer rates associated with liquid impingement on a surface...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices thermal stresses thermal expansion integrated circuit...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 246–253.
Published Online: July 26, 2002
... Editor: S. M. Heinrich. 26 07 2002 integrated circuit reliability ball grid arrays reflow soldering thermal stress cracking plastic packaging integrated circuit modelling integrated circuit packaging Reliability is one of the major concerns for ball grid array (BGA...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 266–270.
Published Online: July 26, 2002
... integrated circuit reliability integrated circuit packaging ball grid arrays integrated circuit modelling life testing integrated circuit testing viscoplasticity stress analysis reflow soldering Rayleigh-Ritz methods failure analysis finite element analysis Recent years have witnessed...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 321–322.
Published Online: December 1, 2001
...). integrated circuit packaging micromechanical devices integrated circuit modelling thermal management (packaging) ...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 12–21.
Published Online: March 8, 2001
..., 2001. Associate Editor: M. Shiratori. 15 October 2000 08 March 2001 copper integrated circuit interconnections thermal stresses stress relaxation interface phenomena failure analysis finite element analysis integrated circuit modelling diffusion barriers Finite...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 232–237.
Published Online: November 27, 2000
...: A. Tay. 27 November 2000 computational fluid dynamics ball grid arrays natural convection forced convection integrated circuit modelling Creating validated thermal models of electronic packages has always been a challenge in the electronics industry. Existing metrics...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 240–246.
Published Online: February 15, 2000
.... 03 August 1998 15 February 2000 heat sinks integrated circuit packaging cooling thermal resistance flow visualisation integrated circuit modelling The word “rightsizing” in reference to electronic machines such as computers implies increasing demand for compact structures...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 280–282.
Published Online: December 11, 1998
... by the EEPD June 10, 1998; revised manuscript received December 11, 1998. Associate Technical Editor: B. Michel. 10 June 1998 11 December 1998 integrated circuit modelling stress analysis finite element analysis Comparing Figs. 1 2 3 with cross-sections of actual PTH’s (Fig...
Topics:
Stress analysis (Engineering)