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Keywords: heterojunction bipolar transistors
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
...Hsien-Cheng Tseng Advanced collector-up (C-up) heterojunction bipolar transistors (HBTs) with the thermal-via configuration (TVC) have been analyzed using a genetic algorithm (GA). Novel packaging structures are presented and evaluated in detail. With careful optimization, the thermal performance...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044501.
Published Online: October 21, 2009
...Pei-Hsuan Lee; Hsien-Cheng Tseng; Jung-Hua Chou We devise a finite-element model to analyze the thermal performance of collector-up (C-up) heterojunction bipolar transistors (HBTs) with a thermal-via configuration. A demonstration on the GaInP/GaAs C-up HBT is presented in this Brief...
Journal Articles
J. Puigcorbe´, S. Marco, S. Leseduarte, M. Carmona, O. Vendier, C. Devron, S. L. Delage, D. Floriot, H. Blanck
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 549–555.
Published Online: December 15, 2003
.... 115–119. Bahl , S. R. , Camnitz , L. H. , Houng , D. , and Mierzwinski , M. , 1996 , “ Reliability Investigation in InGaP/GaAs Heterojunction Bipolar Transistors ,” IEEE Electron Device Lett. , 17 , pp. 446 – 448 . Bayraktaroglu , B. , Barrette , J. , Kehias , L...
