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Keywords: heat transfer
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
Published Online: May 24, 2024
...-mail:  agharai1@binghamton.edu 04 01 2024 22 04 2024 24 05 2024 multichip module liquid cooling heat sink data centers heat transfer The world is being inundated with an overwhelming amount of digital data from numerous sources, including social media, blog posts...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031004.
Paper No: EP-21-1020
Published Online: September 15, 2021
... acting as a thermal diode. The low-profile assembly takes advantage of the phase-changing properties of water inside a sealed chamber. The wettability-patterned plate—when on the cooled side, e.g., forward operation mode—enables spatially controlled dropwise condensation (high heat transfer rate...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
Published Online: June 4, 2020
... the heat transfer performance, due to the common effects of the improved flow distribution and enhanced overall effective thermal conductivity (ETC). Results also show that the MFPF heat sink promotes the improvement of the bottom wall temperature uniformity. Porosity has more pronounced effects on heat...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2021, 143(1): 014501.
Paper No: EP-19-1083
Published Online: June 4, 2020
...Zengchao Chen; Wei Li; Junye Li; Kan Zhou; Zhaozan Feng Experimental research of subcooled flow boiling heat transfer of de-ionized water in a high-aspect-ratio, one-sided heating, vertical rectangular microchannel having a hydraulic diameter of 0.94 mm (5.01 mm × 0.52 mm) is carried out...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031120.
Paper No: EP-19-1127
Published Online: May 4, 2020
...Jeho Kim; J. Michael Brown; Yogendra Joshi; Kevin O'Connor; Marcos Diaz; Zhuomin Zhang; Peiyan Yang The use of computational fluid dynamics/heat transfer (CFD/HT) software has become common in exploring the thermal and hydrodynamic behavior of many electronic products. Well-designed CFD/HT models...
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2018, 140(4): 040802.
Paper No: EP-18-1036
Published Online: October 1, 2018
... ACKAGING . Manuscript received May 4, 2018; final manuscript received August 19, 2018; published online October 1, 2018. Assoc. Editor: Ankur Jain. 04 05 2018 19 08 2018 solar thermal collector solar energy solar selective coating glazing absorber heat transfer nanofluid...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
Published Online: May 17, 2016
... Cooling Evaporation Experimental Experimental Fluid flow Micro heat transfer Thermal analysis Two-phase flow Measurement techniques Nanoscale heat transfer Heat transfer Flow boiling in multi-microchannel evaporators has proved to be a promising means of addressing the increasing...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
Published Online: April 19, 2016
... March 18, 2016; published online April 19, 2016. Assoc. Editor: Mehmet Arik. 19 02 2016 18 03 2016 Algorithms Coupled codes Design methodology Electrical design Heat transfer PWB PWB Design Thermal systems Numerical Integration methods Metal wiring in PCBs carries...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031011.
Paper No: EP-14-1022
Published Online: May 12, 2014
... genetic algorithm heat transfer Constructal theory is the view that the generation of flow configurations is a physics phenomenon that can be based on a physics principle (the constructal law). According to this statement, for a finite-size flow system to persist in time (to survive), its...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
Published Online: April 29, 2014
... in result (3), the aspect ratios of depth to width are larger than 4, which indicate that the heat transfer mainly depends upon the fins. The widths do not always increase with the increasing channel lengths, as can be seen from results (2), (3), (4), and (5), and that shows the complexity of relationship...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 031005.
Paper No: EP-12-1107
Published Online: June 4, 2013
... online June 4, 2013. Assoc. Editor: Amy Fleischer. 08 12 2012 29 03 2013 A numerical study is performed to investigate the effects of nanofluids on the heat transfer performance of a pulsating heat pipe (PHP). Pure water is employed as the base fluid while Al 2 O 3 with two...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
Published Online: April 12, 2013
... than heat added to the sides. Changing the contact length shows that variation in the length of the contact results in negligible changes in required heat to achieve a given displacement. MEMS microswitches heat transfer Heat switches have been used to control the temperature [ 1...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031011.
Published Online: September 26, 2011
...Damena D. Agonafer; J. Yeom; M. A. Shannon Microposts are utilized to enhance heat transfer, adsorption/desorption, and surface chemical reactions. In a previous study [Yeom et al., J. Micromech. Microeng., 19, p. 065025 (2009)], based in part on an experimental study, an analytical expression...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
...Zhanyu Sun; Yogesh Jaluria This paper is directed at the numerical simulation of pressure-driven nitrogen slip flow in long microchannels, focusing on conjugate heat transfer under uniform heat flux wall boundary condition. This problem has not been studied in detail despite its importance in many...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
...Drazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
Published Online: June 7, 2011
...Ningbo Liao; Ping Yang; Miao Zhang; Wei Xue Heat transfer across the interfaces of dissimilar materials is a critical consideration in a wide variety of scientific and engineering applications. In this paper, molecular dynamics (MD) simulations are conducted to investigate the effects of thermal...
Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2011, 133(1): 010301.
Published Online: March 10, 2011
...Marta Rencz 10 03 2011 10 03 2011 cooling electronics packaging heat transfer microchannel flow Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011008.
Published Online: March 10, 2011
... , Y. J. , and Young , T. F. , 2009 , “ Thermal Stress and Heat Transfer Characteristics of a Cu/Diamond/Cu Heat Spreading Device ,” Diamond Relat. Mater. 0925-9635 , 18 , pp. 283 – 286 . 10.1016/j.diamond.2008.10.059 Popova , N. , Schaeffer , Ch. , Avenas , Y...