... in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper...

... simulations. A general fatigue life prediction methodology is next described in detail. Finally, this methodology is tested and verified against the empirical data. ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections...

.... delamination electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment 25 07 2005 19 03 2008 17 11 2008 Underfill materials are used in flip chip...

... and temperature ranges. Since the parameters used in the Sn–Pb solder joint fatigue simulations were derived from mechanical fatigue testing on bulk material and were applied to solder joints, the assumption that the form of the damage law is independent of the nature of the loading conditions appears...

...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...

... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... devices nanoparticles soldering assembling fine-pitch technology fatigue testing mechanical testing delamination fatigue cracks fracture passivation silicon compounds To enhance solder bump reliability in flip chips on organic substrates, an epoxy-based underfill is often dispensed...

...) until convergence is achieved or termination is indicated. For this method, each iteration is equivalent to one complete analysis loop. 23 10 2004 21 09 2006 thermal management (packaging) solders printed circuits thermal expansion fatigue testing...

..., Version 6.5, Hibbitt, Karlsson, and Sorenson, Inc., Pawtucket, RI. 09 02 2006 05 07 2006 ball grid arrays integrated circuit packaging durability fatigue testing fatigue cracks solders deformation global-local equivalent model submodel fatigue crack...

... stress conditions were imposed to investigate the effects of multiaxial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn 3.8 Ag 0.7 Cu and Sn – Pb eutectic solder. Fractography of fatigue tested samples...

... . flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling...

... to failure in experiment N f p r e d number of cycles to failure in prediction pp test fast-fast straining test SRP strain range partitioning method t loading time in creep-fatigue test t r rupture time in static creep test th test fast...

...Tae-Sang Park; Soon-Bok Lee To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63 Sn ∕ 37 Pb and Sn ∕ 3.5 Ag ∕ 0.75 Cu solder joints in room...

...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from...

... with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life...

... and Thermal Loading,” Ph.D dissertation, SUNY at Buffalo. Adams, P. J., 1986 “Thermal fatigue of Solder Joints in Micro-Electronic Devices,” MS thesis, Dept. of Mechanical Engineering, MIT. McDowell, D. L., Miller, M. P. and Brooks, D. C., 1994 Fatigue Testing of Electronic Materials , ASTM STP 1153...

... Induced Plastic Deformation in Solder Joints—Part Two: Accumulated Deformation in Through Hole Joints ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. , 14 , pp. 824 – 832 . thermomechanical treatment fatigue testing thermal stresses soldering eutectic alloys tin alloys bismuth alloys...