...Michael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink In ongoing research at the University of Idaho, potential failure mechanisms of airbag initiators are being investigated. Cracking of the cylindrical glass-to-metal seal (GTMS) present in these devices has been observed...

... (Fig. 3 ). With the addition of the silicone coating, this problem is alleviated. It is expected that the structural integrity of the transformer can be improved with the application of the coating. 21 09 2007 22 04 2008 11 02 2009 cooling electronics packaging failure...

.... The thermomechanical properties of underfill therefore become crucial factors to the service life of FCBGA. ball grid arrays flip-chip devices failure (mechanical) integrated circuit reliability integrated circuit packaging creep testing thermal stress cracking solders Young's modulus thermal...

... leading to fracture and failure, and cyclic mechanical and thermal loading including rate, dwell time, and amplitude. solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging 01 May 2003 01 January 2004 08 07 2004...

... irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 4 Effect of phase size λ 0 on load-displacement curve for miniature specimen 5 Comparison of Load-displacement curves for miniature specimen Figure 6...

... electron microscopy failure (mechanical) Microstructural examination on the cross-section of a post-impact ICA SM joint indicated the formation of an interface crack between the ICA and the copper pad, as shown in Fig. 10 . This clearly shows that there could be inadequate interfacial strength...

... lead alloys silver alloys failure (mechanical) packaging More than twenty-five years ago, it was shown that low-cycle fatigue is the primary cause of solder joint failure in electronic assemblies 1 . This problem has become more important during the last decade with the switch to surface...