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Keywords: failure (mechanical)
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011009.
Published Online: February 13, 2009
...Michael R. Maughan; Robert R. Stephens; Donald M. Blackketter; Karl K. Rink In ongoing research at the University of Idaho, potential failure mechanisms of airbag initiators are being investigated. Cracking of the cylindrical glass-to-metal seal (GTMS) present in these devices has been observed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011003.
Published Online: February 11, 2009
.... The modeling result is shown to corroborate with the actual performance of the transformer. 21 09 2007 22 04 2008 11 02 2009 cooling electronics packaging failure (mechanical) finite element analysis thermal stresses transformers Encapsulation is widely used in electronic...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
..., and high glass transition temperature leads to the longest service life. Manuscript received August 28, 2003; revision received June 8, 2004. Review conducted by: Y.-H. Hung. 28 August 2003 08 June 2004 24 01 2005 ball grid arrays flip-chip devices failure (mechanical...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
Published Online: July 8, 2004
... 2003 01 January 2004 08 07 2004 solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging For realistic design, reliability and failure analysis of materials such as solders for problems in electronic packaging...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... alloys lead alloys fatigue viscoplasticity creep irreversible thermodynamics failure analysis finite element analysis materials testing failure (mechanical) 01 June 2001 01 October 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... interconnections circuit reliability scanning electron microscopy failure (mechanical) Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering material. When components and assemblies soldered...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... alloys bismuth alloys lead alloys silver alloys failure (mechanical) packaging 30 June 1999 03 September 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD June 30, 1999...