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Keywords: eutectic alloys
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031009.
Published Online: September 23, 2011
... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys Stephens and Frear [( 31 )] studied the creep behavior...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
... on the wetting phenomena. The solidification of molten solder after wetting results in a permanent bond. Therefore, the solderable surfaces must allow the molten solder to wet and spread within the available time ( 4 5 ). The conventional solder is a eutectic or near-eutectic alloy of tin and lead. The use...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... lead alloys tin alloys plasticity eutectic alloys indentation elastic deformation plastic deformation hardness testing integrated circuit packaging 16 06 2005 04 10 2006 The current study is motivated by the trend of miniaturization of microelectronics solder...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
... analyses for the life assessment for electronic packages and assemblies. In this study, the rate-dependent deformation and fatigue fracture behavior of Sn 3.8 Ag 0.7 Cu Pb -free alloy and Sn – Pb eutectic alloy was investigated with thin-walled specimens using a biaxial servo-controlled tension–torsion...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... topography surface morphology adhesion solders scanning electron microscopy X-ray chemical analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium 03 04 2005 29 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 202–207.
Published Online: November 24, 2005
... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 331–338.
Published Online: September 29, 2005
... of the various approaches are mutually consistent. 29 12 2004 29 09 2005 flip-chip devices reflow soldering solders surface tension eutectic alloys As demands on the performance of computers, communication systems, and optoelectronic products rapidly increase, electronic packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 147–156.
Published Online: September 14, 2004
... Deformation in Solder Joints-Part I: Accumulated Deformation in Surface Mount Joints ,” ASME J. Electron. Packag. 1043-7398 , 113 , pp. 8 – 15 . 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders electronics packaging viscoelasticity viscoplasticity...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
Published Online: July 8, 2004
... JSM 5800-LV, with an accelerating voltage of 20 keV. 01 March 2003 01 December 2003 08 07 2004 tin alloys silver alloys copper alloys eutectic alloys ageing crystal microstructure softening dispersion hardening tensile testing quench hardening solders...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
... are obtained between the experimental and simulated results. To whom correspondence should be addressed. e-mail: msyi@ntu.edu.sg Grivas , D. , Murty , K. L. , and Morris , J. W. , 1979 , “ Deformation of Pb-Sn Eutectic Alloys at Relatively High Strain Rates ,” Acta Metall...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 74–78.
Published Online: June 29, 2000
... 29 June 2000 tin alloys lead alloys eutectic alloys soldering fatigue plastic deformation finite element analysis Tin (Sn)–lead (Pb) alloys with near eutectic compositions have been widely used as soldering materials in the package of semiconductor and communication devices...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 278–283.
Published Online: October 20, 1999
.... 20 October 1999 tin alloys lead alloys soldering creep viscoplasticity grain size free energy finite element analysis eutectic alloys The Pb-Sn eutectic alloy acts as both electrical and mechanical connection within and among the different surface mount packaging levels...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 48–54.
Published Online: September 3, 1999
... thermal stresses soldering eutectic alloys tin alloys bismuth alloys lead alloys silver alloys failure (mechanical) packaging 30 June 1999 03 September 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING...