.... Our goal in this study is to investigate the ability of finite element models to accurately capture the transient response of a complex portable electronic product under shock and drop loading. Finite element models of the system are generated and calibrated with experimental results, first...

...Fei Qin; Tong An; Na Chen; Jie Bai Behavior of solder joints in microelectronic packages is crucial to the drop impact reliability design of mobile electronic products. In this paper, tensile behaviors of Sn37Pb, Sn3.5Ag, and Sn3.0Ag0.5Cu at strain rates of 600 s − 1 , 1200 s − 1 , and 1800 s − 1...

... telecommunication equipment electronic products thermal management (packaging) forced convection The advances in the field of telecommunications during the past decade have had an enormous impact on society through the widespread use of the Internet. However, the advances in processors and custom...