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Keywords: electronic packaging
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021010.
Paper No: EP-23-1059
Published Online: December 11, 2023
...Tongju Wang; Yahao Liu; Wenqian Zhang; Yongping Lei; Jian Lin; Hanguang Fu; Zipeng Lin Solder balls used in electronic packaging should have high dimensional and shape accuracy requirements to ensure the connection quality of solder balls during soldering. However, the existing solder ball...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
Published Online: December 1, 2021
...@usm.my 13 09 2021 25 10 2021 01 12 2021 bump pitch design optimization electronic packaging flip-chip gap height underfill encapsulation Rapid technological advancements drive the micro-electronics sector to focus on both miniaturization and performance aspects...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2022, 144(1): 010803.
Paper No: EP-21-1007
Published Online: August 6, 2021
... 2021 06 08 2021 electronic packaging flip-chip package's reliability underfill encapsulation void occurrent References [1] Wong , C. P. , Luo , S. , and Zhang , Z. , 2000 , “ Flip the Chip ,” Science , 290 ( 5500 ), pp. 2269 – 2270 . 10.1126...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014501.
Paper No: EP-19-1040
Published Online: September 19, 2019
... 2019 19 09 2019 additive manufacturing organic interposers inkjet printing rapid prototyping electronic packaging An interposer is an electrical interface used for routing between two connections. In fact, the purpose of an interposer is to spread a connection to a wider pitch...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
Published Online: May 24, 2019
..., 2019; published online May 24, 2019. Assoc. Editor: Toru Ikeda. 21 08 2018 22 04 2019 3DPC ceramic substrate aluminosilicate cement shear strength electronic packaging thermal reliability Currently, ceramic substrate has drawn considerable attention in power electronics...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021004.
Published Online: June 11, 2012
... solid-state bonding electronic packaging Si chip Cu substrate At present, nearly all large-scale integrated circuit chips are packaged with flip-chip interconnect technology. The chip is flipped over and the active (front) side is connected to the package using numerous tiny solder joints...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
Published Online: September 30, 2011
... and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages ,” IEEE Trans. Electron. Packag. , 25 ( 3 ), pp. 185 – 192 . 10.1109/TEPM.2002.801649 3 Frear , D. R. , Jang , J. W. , Lin , J. K. , and Zhang , C. , 2001 , “ Pb-Free Solders for Flip-Chip Interconnects ,” JOM...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...
Journal Articles
Publisher: ASME
Article Type: Design Innovations
J. Electron. Packag. September 2010, 132(3): 035001.
Published Online: September 30, 2010
... and utilized in production. On the other hand, the preliminary results in this study show that Ag flip-chip joints can indeed be fabricated at 250 ° C . silver joints flip-chip direct bonding solid-state bonding process electronic packaging integrated circuits In the flip-chip technology...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011003.
Published Online: January 31, 2008
... of the electronic packaging assembly is performed with fatigue crack length prediction (and thus package reliability) as the ultimate goal. A FEA model was built to predict the TMF of the BGA assembly. The model geometry was based on dimensioned cross-sectional photographs of the BGA package, solder joints...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 419–426.
Published Online: February 6, 2006
... Methodologies and Their Applications Die Strength ,” IEEE Trans. Adv. Packag. 1521-3323 , 26 ( 2 ), pp. 423 – 428 . Cotterell , B. , Chen , Z. , Han , J. B. , and Tan , N. X. , 2003 , “ The Strength of the Silicon Die in Flip-Chip Assemblies ,” ASME J. Electron. Packag. 1043...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 200–207.
Published Online: July 17, 2004
... and effectively modeled using the standard implicit time-integration code. 10 05 2004 17 07 2004 printed circuit manufacture electronics packaging bending finite element analysis heat transfer Electronic Packaging Drop Impact Dynamics Finite Element There has been increasing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
... in Eutectic Solder Alloy ,” Int. J. Fatigue 0142-1123 , 22 , pp. 217 – 228 . Solomon , H. D. , and Tolksdorf , E. D. , 1995 , “ Energy Approach to the Fatigue of 60∕40 Solder: Part I-Influence of Temperature and Cycle Frequency ,” ASME J. Electron. Packag. 1043-7398 , 118 , pp. 130...