... International ASME Conference on Nanochannels, Microchannels and Minichannels , ASME, Pohang. 28 02 2010 26 05 2010 09 09 2010 09 09 2010 cooling design engineering DP industry gallium alloys liquid metals thermal resistance liquid metal cooling electromagnetic pump...

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... design engineering neural nets fatigue moire fringes 29 July 1998 09 December 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING .  Manuscript received by the EEPD July 29, 1998; revision received December 9...

... October 1999 09 December 1999 packaging fracture bending plastic packaging delamination design engineering integrated circuit packaging Interfaces in electronics packages are susceptible to delamination due to demanding packaging requirements and stringent qualification...

... Technical Editor: B. Courtois. 10 February 1999 13 August 1999 packaging modules neural nets finite element analysis soldering integrated circuit packaging design engineering Materials used in the construction of electronic packages are often complex in their behavior...