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Journal Articles

A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 212–220.
https://doi.org/10.1115/1.1462625
Published Online: July 26, 2002
... stress cracking printed circuit manufacture life testing production testing fracture mechanics finite element analysis creep fracture chip scale packaging reflow soldering There are at least two major reasons why directly attaching the solder bumped flip chip on PCB is not popular yet 1...
View Article titled, A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
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Topics: Corners (Structural elements), Fracture (Materials), Solder joints, Fatigue, Density, Semiconductor wafers, Cycles