... relevance. These were measured as outlined below. ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high...

... reveal that the creep strain develops differently in the tensile and compression regions. A new parameter is proposed for estimating fatigue life when the strain rate varies in the loading direction. 13 12 2009 14 09 2010 03 12 2010 03 12 2010 copper alloys creep fatigue...

... strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys 09 12 2009 14 09 2010 23 11 2010 23 11 2010 The method described in Sec. 4 was applied to all the cyclic loadings...

... had a higher modulus, lower CTE, and slightly higher T g . 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys The move...

... copper copper alloys electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier version of this paper...

..., the miniature size specimen of which microstructure is the same as that of solder joints should be used in the stepped ramp wave loading test as necessary. 09 05 2008 26 11 2008 27 03 2009 copper alloys creep deformation elastoplasticity silver alloys solders stress-strain...

... simulations. A general fatigue life prediction methodology is next described in detail. Finally, this methodology is tested and verified against the empirical data. ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections...

... 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening The insatiable demand...

... electromigration is responsible for metallization failures that lead to an excessive increase in the resistance of the solder joints. electromigration flip-chip solder joint reliability Sn–Ag–Cu Cu weight content copper alloys electromigration flip-chip devices gold nickel reliability...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... to be a satisfactory one. Work is in progress to apply the estimated parameters for SnAgCu solder joints to different package constructions and environmental conditions. 05 01 2007 20 08 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated...

... 01 2008 copper alloys flip-chip devices printed circuits silver alloys solders tin alloys reliability flip chip thermal cycling micro-via Thermal excursions for electronic devices imparted during their operation can change the microstructure of their solder joints...

... mm , and the height was 10.0 mm . Figure 3 illustrates a completed DLS test vehicle that is ready for testing. DLS test assembly, edge and face views 27 09 2006 06 07 2007 31 01 2008 copper alloys creep fatigue finite element analysis plasticity...

.... fatigue prediction lead-free solder electronic packaging copper alloys creep fatigue cracks finite element analysis plasticity silver alloys solders tin alloys 13 10 2006 19 07 2007 31 01 2008 Full model thermal profile, simulation substeps, and results of file...

... cyclic bending load at 25 ° C and 125 ° C based on FEA results and experimental data using strain energy density as a fatigue damage control parameter. cyclic bend test fatigue model lead-free solder Sn–Ag–Cu bending strength copper alloys electronics packaging...

.... 307 – 312 . fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography Many factors can affect...

... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. 06 12 2005 21 05 2006 solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys...

... . flip-chip devices electromigration solders integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling...

... and electrically ( 1 ). flip-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys 13 09 2004 24 11 2005 2006 American Society of Mechanical Engineers ...

... of the package was 892 h, and the average ultimate service time of the package was 1053 h. 17 08 2004 13 01 2005 metallisation reliability integrated circuit packaging reflow soldering testing tin aluminium alloys nickel alloys vanadium alloys copper alloys dies (machine tools...