.... It is especially important while performing rapid prototyping and quick design studies of extreme heat flux cooling devices. One of the major issues plaguing the use of laser micromachining to manufacture commercially usable devices, is the formation of debris during cutting and the difficulty in removing...

...Houxue Huang; Navid Borhani; John Richard Thome Multi-microchannel evaporators with flow boiling, used for cooling high heat flux devices, usually experience transient heat loads in practical applications. These transient processes may cause failure of devices due to a thermal excursion or poor...

... a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches...

..., and facilitates realization of VLSI and ULSI technologies. However, utilizing the third dimension to provide additional device layers poses thermal challenges due to the increased heat dissipation and complex electrical interconnects among different layers. The conflicting needs of the cooling system requiring...

... such as water or the like. In this paper, utilizing thermosyphon effect to drive room temperature liquid metal for electronic cooling was proposed for the first time with its technical feasibility demonstrated. This may lead to a self supported cooling which just utilizes the waste heat produced by the hot chip...

... of downhole electronics at an ambient temperature of 200–250 °C. It was observed that the ability of the thermal management system to keep electronics cool varied from 30 °C to a few degrees below the surrounding temperature, for chip wattage varying from 0 W to 8 W, respectively. 15 06 2010 19 07...

...Jing He; Liping Liu; Anthony M. Jacobi Thermal analysis with comprehensive treatment of conjugate heat transfer is performed in this study for discrete flush-mounted heat sources in a horizontal channel cooled by air. The numerical model accounts for mixed convection, radiative exchange and two...

... planes. So, to optimize board cooling, the designer has more and more to deal with PCB architecture including high density interconnect (HDI) technology, which relies on small diameter laser drilled micro-vias. Compared with conventional PCB technologies, HDI creates denser interconnect substrates...

...Ed J. Walsh; Thomas J. Breen; Jeff Punch; Amip J. Shah; Cullen E. Bash The chiller cooled data center environment consists of many interlinked elements that are usually treated as individual components. This chain of components and their influences on each other must be considered in determining...

...Huy N. Phan; Dereje Agonafer Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex mathematical equations or the assistance of an expensive computation-fluid...

...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...

...Marta Rencz 10 03 2011 10 03 2011 cooling electronics packaging heat transfer microchannel flow Microelectronics thermal experts from four continents met in the fall of 2009 at the 15th THERMINIC Workshop in Leuven, Belgium. The event was sponsored by the IEEE Computer...

...A. Kargar; B. Ghasemi; S. M. Aminossadati Computational fluid dynamics (CFD) and artificial neural network (ANN) are used to examine the cooling performance of two electronic components in an enclosure filled with a Cu-water nanofluid. The heat transfer within the enclosure is due to laminar...

... a thermal management perspective. Considerable ongoing research efforts focus on optimizing the room layouts and equipment design in order to achieve the desired cooling. However, the detrimental impact of underfloor blockages, which occur widely, is seldom addressed. These blockages often take the form...

...Thomas J. Breen; Ed J. Walsh; Jeff Punch; Amip J. Shah; Cullen E. Bash To achieve reductions in the power consumption of the data center cooling infrastructure, the current strategy in data center design is to increase the inlet temperature to the rack, while the current strategy for energy...

... ,” Proceedings of the IEEE International Telecommunication Energy Conference , pp. 1 – 6 . Greabner , J. E. , 1995 , “ Thermal Conductivity of Printed Wiring Board ,” Technical Brief, Electronics Cooling Magazine 1 ( 2 ), p. 27 . MuAnalysis Inc. , 2008 , “ Lumileds Luxeon K2 LED Lamp...

.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...

...Eduardo Martínez-Galván; Juan Carlos Ramos; Raúl Antón; Rahmatollah Khodabandeh Experimental measurements in a spray cooling test rig have been carried out for several heat fluxes in the heater and different spray volumetric fluxes with the dielectric refrigerant R134a. Results of the heat transfer...

...Tannaz Harirchian; Suresh V. Garimella Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due...

... of the module, focusing in particular on the heat diffusion time and R C thermal time constant. Based on the material properties reported in the literature, we project that cooling power densities > 10 W / cm 2 may be achieved across Δ T of the order of 10 K at coefficient of performance (COP) > 10...