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Journal Articles

Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)

M. Dube, T. Kundu
Journal: Journal of Electronic Packaging
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045502.
DOI: https://doi.org/10.1115/1.4000902
Published Online: November 17, 2011
...M. Dube; T. Kundu 20 03 2006 13 08 2009 17 11 2011 17 11 2011 compressibility elastoplasticity hardening solders viscoplasticity We respond to the technical content of the discussion as follows: 1 Discussant appears to have erroneously assumed...
View Article titled, Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag. , 127, pp. 147–156)
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Topics: Electrons, Solders, Hardening