...) 11 07 2011 07 09 2011 17 11 2011 17 11 2011 channel flow convection cooling emissivity radiative transfer thermal analysis thermal conductivity walls thermal analysis air cooling conjugate heat transfer discrete heat sources Rapid increase in heat...

... and steady operations is reduced if the frequency is high. However, flow frequency has nearly no effect on the pressure drop in the channel. 09 06 2008 27 09 2008 13 02 2009 channel flow finite element analysis thermal management (packaging) transients chip cooling flow...

... region are zero everywhere, which is automatically guaranteed by a numerical solution algorithm for the conjugated problem ( 22 23 ). Effect of channel width on thermal resistance and max heat flux 29 11 2005 13 12 2006 channel flow cooling heat sinks pressure...

... process for a particular dispensing application by rationally choosing the dispensing conditions rather than using trial and error. electronics packaging channel flow Fluid dispensing is a method to deliver fluid materials in a controlled manner, which...

... heat sinks parametric design studies. impingement flow heat sink pressure drop plate fin thermal management (packaging) heat sinks laminar flow channel flow 01 03 2006 06 07 2006 The heat dissipated in electronic components is increasing...

... and experiments on flow over dimpled surfaces was performed, and key parameters and flow structure were identified and summarized. With these premises, a numerical model was developed. The model was validated with published experimental data from selected papers and fine tuned for channel flow within the laminar...

... and experiment design optimization channel flow B bottom plate thickness C h s surface length of the heat sources exposed to convection d separation distance d ¯ normalized separation distance ∊ [0,1] e uncertainty...

...D. Rundström; B. Moshfegh The current trends toward the greater functionality of electronic devices are resulting in a steady increase in the amount of heat dissipated from electronic components. Forced channel flow is frequently used to remove heat at the walls of the channel where a PCB...

...) channel flow The integrated circuit (IC) industry is manufacturing denser and more powerful products, thus necessitating a better cooling technology to prevent the demand from heat dissipation devices. The objective of thermal management is to ensure that the temperature of each component in an IC...

... For Electronics Multilayer Structures With Compact Cold Plates ,” Master’s thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan. 04 12 2004 18 03 2005 thermal management (packaging) heat sinks channel flow liquid crystals forced convection cooling...

... on the thermal resistance of the heat sink is discussed. Detailed measurements on an instrumented heat sink estimate that the average heat transfer coefficients in the channel flow between the fins is 2.5 times that of a steady flow in the ducts at the same Reynolds Number. 27 01 2003 23 12 2004...

... procedure. 25 02 2004 17 12 2004 thermal management (packaging) heat sinks integrated circuit packaging two-phase flow microfluidics channel flow coolants Thermal engineers in the electronics industry are facing unprecedented challenges of removing enormous amounts of heat...

... never observed. A flow pattern map was constructed and compared with previous maps and predictions of flow pattern transition models. Features unique to two-phase micro-channel flow were identified and employed to validate key assumptions of an annular flow boiling model that was previously developed...

... channel flow laminar flow water 16 02 2004 09 08 2004 2005 American Society of Mechanical Engineers ...

... the fabricated microchannel. silicon compounds alumina microfluidics micromachining channel flow electrophoresis osmosis numerical analysis mixing Recent progress of the surface micromachining technology expands the frontier of engineering applications. Some of them include...

.... 0960-1317 10.1088/0960-1317/3/4/009 , 3 , pp. 206 – 208 . Incropera , F. P. , 1999 , Liquid Cooling of Electronic Devices by Single-Phase Convection , Wiley , NY. 06 04 2004 05 08 2004 channel flow microfluidics Poiseuille flow friction surface roughness...

... examined and deemed unsuitable for micro-channel heat sinks because all these correlations are based on turbulent flow assumptions, and do not capture the unique features of micro-channel flow such as abrupt transition to slug flow, hydrodynamic instability, and high droplet entrainment in the annular...

... cooling channel flow two-phase flow power semiconductor devices Several cooling schemes have been developed in recent years to combat the large increases in heat dissipation from electronic and power devices. Air-cooled heat sinks are presently found in most personal computers, but are rapidly...

.... integrated circuit packaging natural convection forced convection cooling external flows pulsatile flow pipe flow channel flow boundary layers laminar flow When D becomes sufficiently small, the channel formed between two boards becomes narrow enough for the flow and heat transfer...

... cooling thermal resistance heat exchangers forced convection thermal management (packaging) temperature distribution channel flow Cold Plate Thermal Resistance Nusselt Number Reynolds Number Heat Transfer Performance Factor Pumping Power Factor Colburn Analogy A cold plate device...