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Keywords: bump/UBM
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
Published Online: January 13, 2005
...) solders flip-chip devices high-temperature electronics flip-chip bump/UBM BGA lead-free solder reliability test In packages, defects are mostly found in solder joints. To meet the requirement of environment protection, the related research and development of the lead-free solder become...
