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Keywords: bonding
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031119.
Paper No: EP-20-1022
Published Online: August 17, 2020
... these debris efficiently after the machining process. For silicon substrates, this debris can interfere with surrounding components and cause problems during bonding with other substrates by preventing uniform conformal contact. This study delves deep into the challenges faced and methods to overcome them...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
...Pin J. Wang; Jong S. Kim; Chin C. Lee A novel process of bonding silver (Ag) foils to copper (Cu) substrates has been developed. This direct bonding method does not use any intermediate layer in between. An important application of this process is electronic packaging where semiconductor device...