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Keywords: boiling
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011001.
Published Online: March 2, 2011
...Tannaz Harirchian; Suresh V. Garimella Flow boiling in microchannels has been investigated extensively over the past decade for electronics cooling applications; however, the implementation of microchannel heat sinks operating in the two-phase regime in practical applications has lagged due...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
Published Online: November 13, 2008
...Michel Speetjens Pool-boiling serves as the physical model problem for electronics cooling by means of phase-change heat-transfer. The key for optimal and reliable cooling capacity is better understanding of the conditions that determine the critical heat-flux (CHF). Exceeding CHF results...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011010.
Published Online: February 12, 2008
... immersion cooling with fluorocarbons have shown the effectiveness of boiling enhancement structures in lowering boiling incipience, raising the critical heat flux, and reducing evaporator size. Two-phase thermosyphons are an alternative to liquid immersion cooling, where phase change liquid cooling can...
Topics: Boiling, Pressure
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 398–404.
Published Online: February 1, 2006
...Tailian Chen; Suresh V. Garimella The effects of dissolved air in the dielectric liquid FC-77 on flow boiling in a microchannel heat sink containing ten parallel channels, each 500 μ m wide and 2.5 mm deep, were experimentally investigated. Experiments were conducted before and after degassing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 288–300.
Published Online: October 6, 2004
... never observed. A flow pattern map was constructed and compared with previous maps and predictions of flow pattern transition models. Features unique to two-phase micro-channel flow were identified and employed to validate key assumptions of an annular flow boiling model that was previously developed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
Published Online: October 6, 2004
... was correlated well as a function of the static pressure difference between the two vertical tubes. All chips showed the boiling curve similar to that for pool boiling except that the critical heat flux was lower for the natural circulation loop. For all chips tested, the maximum allowable heat flux q max...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 213–224.
Published Online: July 8, 2004
...Weilin Qu, Graduate Research Assistant, Student Mem. ASME; Issam Mudawar, Professor, Fellow ASME The design and reliable operation of a two-phase micro-channel heat sink require a fundamental understanding of the complex transport phenomena associated with convective boiling in small, parallel...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 127–134.
Published Online: June 1, 2004
... performance. The boiling was found to be surface tension dominated, and a simple model based on heat transfer from the outer surface is proposed. As much as 149 W were dissipated from a 1 cm 2 heated area. 13 11 2003 01 06 2004 A parametric investigation of performance was performed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 475–479.
Published Online: December 15, 2003
...Giulio Lorenzini; Cesare Biserni This research is aimed at investigating by experimental means a possible use of the Vapotron Effect for the cooling of electronic devices. The problem deals with a particular kind of subcooled boiling which is able to enhance heat exchange between a non-isothermal...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
Published Online: September 17, 2003
... to, pool boiling thermosyphons because of the former’s ability to separate the path of replenishment liquid from that of the released vapor. Experiments were performed to explore the effects of boiler gap (separation distance between the boiling surface and opposite insulating wall) on cooling performance...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 276–281.
Published Online: June 10, 2003
... heat transfer and pressure drop. In general it is found that high-pressure fluids will give better performance and more compact designs as high-pressure results in higher boiling heat transfer coefficients and smaller necessary tube diameter. Apart from the properties related to the performance...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 132–137.
Published Online: February 18, 2000
... November 1998 18 Feb 2000 organic compounds cooling thermal management (packaging) jets boiling foils heating elements forced convection dielectric liquids Immersion cooling of integrated circuit chips by dielectric coolant received considerable interest in the 1970s and 1980s...