1-6 of 6
Keywords: bending strength
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
Published Online: February 8, 2023
...M. Y. Tsai; T. C. Kuo This paper aims to demonstrate the biaxial bending strength test on thin silicon dies using the classic ball-on-ring (BoR) test and discuss it in detail by comparing those results with the newly-proposed point load on elastic foundation (PoEF) test. The geometric linear...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031002.
Paper No: EP-20-1125
Published Online: September 15, 2021
...M. Y. Tsai; H. Y. Liu The ball-on-ring (BoR) test, one of the most popular biaxial bending tests, is thoroughly investigated in this study for determining the bending strength of thin silicon dies. The application of this test method with a linear theory to the thin dies is also reevaluated using...
Journal Articles
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 496–503.
Published Online: August 27, 2007
... cyclic bending load at 25 ° C and 125 ° C based on FEA results and experimental data using strain energy density as a fatigue damage control parameter. cyclic bend test fatigue model lead-free solder Sn–Ag–Cu bending strength copper alloys electronics packaging...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
... impact testing impact strength filled polymers conducting polymers shear strength bending strength scanning electron microscopy Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
Published Online: September 2, 1998
... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...