... of simplified approaches. After a review of the available modeling strategies, steady state thermal analysis of a typical stacked ball grid array package based on a thermal resistance network is presented. The physical model is discussed in detail, together with its advantages and limitations. The results have...

...Hung-Jen Chang; Jung-Hua Chou; Tao-Chih Chang; Chau-Jie Zhan; Min-Hsiung Hon; Chi-Shiung Hsi Five halogen-free (HF) dummy plastic ball grid array (PBGA) components with daisy-chains and Sn4.0Ag0.5Cu (SAC405) Pb-free solder balls were assembled on a HF high density interconnection (HDI) printed...

... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...

...Z. Kornain; A. Jalar; R. Rasid; S. Abdullah Phenolic and amine epoxy systems are widely used as hardeners in underfill materials for flip chip packaging. A comparison was made between these two systems in order to evaluate the reliability performance of a flip chip plastic ball grid array (FC-PBGA...

... the chances for TIM delamination. 21 01 2010 06 05 2010 11 06 2010 11 06 2010 assembling ball grid arrays electronics industry finite element analysis moisture polymers reliability thermal management (packaging) thermal resistance thermal interface material debonding...

... of interface delamination between epoxy molding compound and silicon die in the flip chip ball grid array package. 14 02 2009 10 01 2010 19 03 2010 19 03 2010 It has been demonstrated that it is possible to optimize design factors to reduce the risk of underfill delamination between...

... as heaters were first designed, fabricated, and calibrated. We next packaged the test chips into low profile, fine pitch ball grid array (LFBGA) packaging with 196 balls and measured the stresses on chip surfaces inside the packaging. After measuring the packaging induced stress as well as the stress under...

... to measure the warpage of PWBs/PWBAs/chip packages during convective reflow processes. In this paper, the characteristics of the projection moiré warpage measurement system will be described. In addition, the system will be used to measure the warpage of a PWB and plastic ball grid array packages during...

... of Packaging and Assembly Technology ,” IEEE Trans. Compon., Hybrids, Manuf. Technol. 0148-6411 , 16 ( 8 ), pp. 949 – 960 . Lau , J. H. , 1995 , Ball Grid Array Technology , McGraw-Hill , New York . Darveaux , R. , 1997 , “ Solder Joint Fatigue Life Model ,” TMS Annual Meeting...

... with fatigue reliability of a thin-profile fine-pitch ball grid array chip-scale package subjected to power cycling. The numerical model was calibrated using steady-state and power cycling experiments. Following the calibrated numerical model, different power cycling durations on the thermal characteristics...

... field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC...

...Wataru Nakayama An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate...

...Yan Zhang; Johan Liu; Ragnar Larsson A plastic ball grid array component interconnect has been experimentally investigated and modeled on the basis of micropolar theory. The experimental results were analyzed, and the data also provided the verification for the micropolar interface model. Two...

... and are summarized in the following sections. 04 12 2006 30 07 2007 14 02 2008 ball grid arrays ceramics integrated circuit manufacture solders vibrations The low-cycle fatigue failure of solder joints due to coefficient of thermal expansion (CTE) mismatch is fairly well...

... – 72 . 10.1109/96.659508 Sherman , F. S. , 1990 , Viscous Flow , McGraw-Hill , New York . A surface area BGA ball grid array C D drag...

... to capture the deformation kinematics. Component types examined include plastic ball-grid arrays, tape-array ball-grid array, quad-flat-no-lead package, and conduction-cooled ball-grid array. Model predictions have been correlated with experimental data. Impact of experimental error sources on model...

.... Previous studies on electronic reliability for automotive environments have addressed the damage mechanics of solder joints in plastic ball-grid arrays on non-metal-backed substrates ( Lall et al., 2003, “Model for BGA and CSP in Automotive Underhood Environments,” Electronic Components and Technology...

... in finite-element simulations. The developed technique has been used to determine the thermomechanical reliability of organic and ceramic ball grid array packages, and it is shown that the number of cycles determined by the proposed technique is comparable to the number of cycles determined through...

... 2006 08 09 2006 ball grid arrays durability finite element analysis reliability solders voids (solid) Voids are one of the major categories of manufacturing defects in solder joints of electronic assemblies that can potentially degrade the reliability of interconnects. Voids can...

... aging showed significance within the first 100 h. I – V characteristics of the daisy chained ball grid array devices assembled with and without bumps revealed considerable difference in the breakdown current. The correlation between initial contact resistance of the daisy chain and the final breakdown...