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Keywords: alumina
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
...Chu-Hsuan Sha; Pin J. Wang; Wen P. Lin; Chin C. Lee Silver (Ag) foils are bonded to alumina substrates by a low temperature solid state bonding process. The alumina substrate is premetalized with 40 nm titanium tungsten (TiW) and 2.54 μm gold (Au). The bonding temperature is just 260 °C, compatible...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
...Chu-Hsuan Sha; Chin C. Lee Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure applied. This is a solid-state bonding without any molten phase involved. The Au layer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
Published Online: April 2, 2009
... experiencing turbulent flow. Predictive correlations are generated to ascertain the degree of enhancement based on the fluid’s thermophysical properties. The enhancement is quite small, suggesting the limited usefulness of nanofluids in this particular application. alumina coolants heat exchangers heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 46–52.
Published Online: September 23, 2005
... on thermometer principles to measure thermal impedance and resistance. This device consists of an alumina substrate, titanium tungsten (TiW) layers, gold layers, and thin alumina layers. Then the measured thermal conductivity of the TIM was compared with predictions made by the thermal resistor network model...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 235–236.
Published Online: August 24, 2004
...Sihai Wen; D. D. L. Chung The relative dielectric constant (10 kHz) of alumina was found to increase reversibly (by up to 13%) with compressive stress (up to 18 MPa). The effect of stress on the relative dielectric constant diminishes with increasing stress, such that it is almost absent when...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
... the fabricated microchannel. silicon compounds alumina microfluidics micromachining channel flow electrophoresis osmosis numerical analysis mixing Recent progress of the surface micromachining technology expands the frontier of engineering applications. Some of them include...