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Keywords: Solder Joint Reliability
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021106.
Paper No: EP-21-1010
Published Online: October 6, 2021
... board 21 01 2021 17 06 2021 06 10 2021 PHM canary structures solder joint reliability FE simulation thermomechanical warpage Electronics subjected to thermal cycling loads are prone to solder joint fatigue as a prevalent failure mechanism. Unavoidable differences...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... test modules were damaged due to re-polishing after the nano-indentation tests; 2 test modules survived more than 3000 h of stressing. Table 1 shows the test vehicle number and applied current levels for each module tested. Flip Chip Solder Joint Reliability Electromigration...