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Keywords: Power Electronics
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041103.
Paper No: EP-24-1036
Published Online: June 20, 2024
...Josef Frankhouse; Changgen Li; Han Hu Power electronics are widely serving as core components of propulsion systems in electric vertical takeoff and landing (eVTOL) aircraft. Nevertheless, affected by the Paschen effect, the breakdown voltage of these electronics during flight is significantly...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041103.
Paper No: EP-23-1032
Published Online: October 9, 2023
... inclination greatly influences the turbulence generated by fluid entrainment due to differences in initial velocity profiles and location of secondary stagnation points. Regarding high power electronics with integrated jet impingement schemes, turbulence, and heat transfer rates must be optimized to meet...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
Published Online: November 23, 2022
... thermal conductivities of 6.0 and 8.5 W/m K. HALT specimens were prepared by applying TIM through a 4-mil stencil over AlSiC baseplates in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples...
Includes: Supplementary data
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
Published Online: October 22, 2022
... with Standards such as Joint Electron Device Engineering Council (JEDEC) and Institute for Printed Circuits (IPC) is to the best of our knowledge lacking. To fill this gap, a detailed review of failure mechanism driven reliability models, with emphasis on physics of failure (PoF) for power electronics...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041112.
Paper No: EP-20-1014
Published Online: July 10, 2020
... scattering in the tested HVPE-grown bulk GaN substrates. The results provide useful information for designing thermal management solutions for vertical GaN power electronic devices. References [1] Chatterjee , B. , Kim , T. K. , Song , Y. , Lundh , J. S. , Han , S...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041108.
Paper No: EP-20-1019
Published Online: June 26, 2020
... in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available...
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 388–397.
Published Online: December 21, 2005
...J. Dirker; J. D. van Wyk; J. P. Meyer Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future developments such as three-dimensional integration. This paper...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... Electromigration in solder joints under high direct current density is known as a reliability concern for the future high density microelectronic packaging and power electronic packaging ( 1 2 3 4 5 6 7 ). The trend in flip-chip to increase I ∕ O count drives the interconnecting solder joints...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 323–327.
Published Online: November 25, 1999
... received by the EEPD Division November 25, 1999. Associate Technical Editor: Y. Joshi. 25 November 1999 thermal management (packaging) surface mount technology thermal resistance magnetic devices power electronics In the present microelectronics industrial revolution, designers...