... OF E LECTRONIC P ACKAGING . Manuscript received December 25, 2016; final manuscript received February 28, 2017; published online June 14, 2017. Assoc. Editor: Satish Chaparala. 25 12 2016 28 02 2017 3D packaging CSP Electronic Flexible circuits MEMS Micro vias PWB...

... guidelines fail to prevent such events. Secondary impacts can result in short acceleration pulses with much higher amplitudes and higher frequencies than those in conventional board-level drop tests. Thus, such pulses are likely to excite the high-frequency resonances of printed wiring boards (PWBs...

... 2017 Dielectrics PWB PWB Design Wireless Additive manufacturing (AM) popularly known as three-dimensional (3D) printing is a layer-by-layer approach for the fabrication of 3D objects [ 1 – 4 ]. Hence, it is very easy to fabricate complex structures with complex internal features...

... packaging PWB Heat pipes have been used commercially as passive thermal management devices for electronics since the 1980s [ 1 , 2 ], and recently have been manufactured in flat two-dimensional configurations known as flat heat pipes, vapor chambers, and TGPs [ 3 ]. More recently, there has been...

... boards (PWBs). The major points of discussion are as follows: (1) The system morphology is dictated by the competition between the progress of technology node and the demand for increase in the system size. (2) Only where the miniaturization of cells is achieved so as to deploy a system on a few PWBs...

... March 18, 2016; published online April 19, 2016. Assoc. Editor: Mehmet Arik. 19 02 2016 18 03 2016 Algorithms Coupled codes Design methodology Electrical design Heat transfer PWB PWB Design Thermal systems Numerical Integration methods Metal wiring in PCBs carries...

.... The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing mode” of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure...

... and warpage control becomes a more crucial process during the printed wiring board (PWB) fabrication and package assembly processes. This requirement necessitates more accurate methods of measuring warpage. The fringe projection methods are recent trends for measuring the warpage of chip packages, PWBs...