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Keywords: Moiré interferometry
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Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
... field condition. In this work, the comparative study of PC and ATC was conducted for the reliability of board level interconnects. The comparison was made using both ceramic and organic flip chip ball grid array packages. Moiré interferometry was adopted for the experimental stress analysis. In PC...
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
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Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Journal Articles

A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems

T. Zhang, S. Rahman, K. K. Choi, K. Cho, P. Baker, M. Shakil, D. Heitkamp
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 179–189.
https://doi.org/10.1115/1.2721092
Published Online: July 5, 2006
... characteristics of the fpBGA package. New experimental data were developed for in-plane and/or out-of-plane displacements of the package and the package–board assembly using HASMAP and Shadow Moiré interferometry. In general, a good agreement was obtained between...
View Article titled, A Global–Local Approach for Mechanical Deformation and Fatigue Durability of Microelectronic Packaging Systems
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Topics: Deformation, Durability, Fatigue, Fatigue cracks, Fatigue life, Solder joints, Solders, Cycles, Fracture (Materials), Stress