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Keywords: High Current Density
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
Published Online: March 8, 2022
... of China 10.13039/501100001809 51975594 National Natural Science Foundation of China 10.13039/501100001809 U20A6004 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current density thermal interface material 11 07 2021 13...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
Published Online: September 15, 2021
... distribution, thermal stress, and deformation of the flip chip under high current density were analyzed. At the same time, the influence of thermal interface material's thermal conductivity and operating current on flip chip reliability was studied. The result showed that when the thermal interface material...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... not observe any damage in the solder joint during PDC stressing when very high current density was applied may be due to the low duty factor (0.96%) of PDC. On the other hand, high peak current of PDC generates a lot of heat in the Al trace which leads to its failure when 10 A PDC was applied...