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Keywords: High Current Density
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
Published Online: September 28, 2022
.... Also, it can be concluded that the temperature gradient induced by Joule heating plays a more important role than electron wind in the atomic migration of the printed silver wire subjected to a high current density. The influence of the printed silver wire size on the EM behavior was also analyzed...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
Published Online: March 8, 2022
.... The experimental results were in good agreement with the simulation results. 1 Corresponding author. e-mail:  lijunhui@csu.edu.cn 11 07 2021 13 02 2022 08 03 2022 microelectronics packaging flip chip reliability electric-thermal-force multi-field coupling high current...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
Published Online: September 15, 2021
... distribution, thermal stress, and deformation of the flip chip under high current density were analyzed. At the same time, the influence of thermal interface material's thermal conductivity and operating current on flip chip reliability was studied. The result showed that when the thermal interface material...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... in Solder Joints ,” Proceedings of the 35th International Symposium on Microelectronics, Denver, Colorado , pp. 427 – 432 . Ye , H. , Basaran , C. , and Hopkins , D. , 2003 , “ Damage Mechanics of Microelectronics Solder Joints under High Current Densities ,” Int. J. Solids Struct...