1-13 of 13
Keywords: Electromigration
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
Published Online: September 28, 2022
...Haibin Zhang; Quan Sun; Zhidan Sun; Yebo Lu The electromigration (EM) damage is becoming a severe problem in the printed flexible electronics as the printed circuits are fabricated thinner and thinner due to the development of printing technology. In this work, the EM behavior of printed silver...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
Published Online: September 27, 2022
...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata The larger current densities accompanying increased output of power modules are expected to degrade solder joints by electromigration. Although previous research has experimentally studied electromigration in solder, die...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
...Mitsuaki Kato; Takahiro Omori; Akihiro Goryu; Tomoya Fumikura; Kenji Hirohata Power modules are being developed to increase power output. The larger current densities accompanying increased power output are expected to degrade solder joints in power modules by electromigration. In previous research...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
Published Online: April 10, 2019
...Yasuhiro Kimura; Masumi Saka A critical current density, a criterion of electromigration (EM) resistance in interconnects, above which EM damages initiate has been studied to minimize EM damages of interconnects. In general, the assessment of a critical current density is confined to straight...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021006.
Paper No: EP-14-1025
Published Online: June 1, 2015
... support of national science funding with Grant No. 11172027. We also appreciate the helpful discussion with Professor Jin Chin from Peking University. References [1] Tu , K. N. , 2003 , “ Recent Advance on Electromigration in Very-Large-Scale-Integration of Interconnects ,” J. Appl. Phys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
...Lihua Liang; Yuanxiang Zhang; Yong Liu Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021003.
Published Online: June 11, 2010
...X. Zhao; M. Saka; M. Yamashita; F. Togoh This paper is focused on evaluating the dominant factor for electromigration (EM) in sputtered high purity Al films. A closed-form equation of atomic flux divergence by treating grain boundary diffusion and hillock formation in a polycrystalline structure...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011002.
Published Online: March 4, 2010
...JianPing Jing; Lihua Liang; Guang Meng As the electronics industry continues to push for high performance and miniaturization, the demand for higher current densities, which may cause electromigration failures in an IC, interconnects. Electromigration is a phenomenon that metallic atoms...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021002.
Published Online: March 27, 2009
...Yi-Shao Lai; Ying-Ta Chiu; Chiu-Wen Lee Designed experiments were conducted in this paper to study the effect of Au/Ni/Cu or Cu substrate pad metallization on the electromigration reliability of 96.5Sn–3Ag–0.5Cu flip-chip solder joints with Ti/Ni(V)/Cu under bump metallurgy (UBM) under a current...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041001.
Published Online: November 13, 2008
...Yi-Shao Lai; Ying-Ta Chiu This work presents electromigration reliability and patterns of Sn–3Ag–0.5Cu and Sn – 3 Ag – 1.5 Cu ∕ Sn – 3 Ag – 0.5 Cu composite flip-chip solder joints with Ti ∕ Ni ( V ) ∕ Cu under bump metallurgy (UBM), bonded on Au ∕ Ni ∕ Cu substrate pads. The solder joints were...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031008.
Published Online: August 1, 2008
...Hao Lu; Chun Yu; Peilin Li; Junmei Chen The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
...Yi-Shao Lai; Chiu-Wen Lee; Chin-Li Kao The high-temperature operation life test (HTOL) was conducted in this paper to study electromigration phenomena of solder interconnects in a flip-chip package assembly. We examined the fatigue reliability and morphological patterns of three solder compositions...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
...C. Basaran; H. Ye; D. C. Hopkins; D. Frear; J. K. Lin The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration...