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Keywords: CCD image sensors
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 225–231.
Published Online: July 8, 2004
... leading to fracture and failure, and cyclic mechanical and thermal loading including rate, dwell time, and amplitude. solders failure (mechanical) finite element analysis nondestructive testing CCD image sensors electronics packaging 01 May 2003 01 January 2004 08 07 2004...
