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Keywords: ATC
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
...S. B. Park; Izhar Z. Ahmed The importance of power cycling as a mean of reliability assessment was revisited for flip chip plastic ball grid array (FC-PBGA) packages. Conventionally, reliability was addressed empirically through accelerated thermal cycling (ATC) because of its simplicity...
