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Journal Articles

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

H. Doi, K. Kawano, A. Yasukawa, T. Sato
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 322–327.
https://doi.org/10.1115/1.2792641
Published Online: December 1, 1998
View Article titled, Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders
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Topics: Flat heat pipes, Flip-chip devices, Reliability, Solder joints, Delamination, Failure mechanisms, Fatigue life, Flip-chip packages, Mechanical properties, Shapes
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

S. Kamiya, H. Takahashi, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 367–371.
https://doi.org/10.1115/1.2792648
Published Online: December 1, 1998
View Article titled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Journal Articles

Adhesion and Reliability of Polymer/Inorganic Interfaces

S.-Y. Kook, J. M. Snodgrass, A. Kirtikar, R. H. Dauskardt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 328–335.
https://doi.org/10.1115/1.2792642
Published Online: December 1, 1998
View Article titled, Adhesion and Reliability of Polymer/Inorganic Interfaces
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Journal Articles

Potential Failure Sites in a Flip-Chip Package With and Without Underfill

E. Madenci, S. Shkarayev, R. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 336–341.
https://doi.org/10.1115/1.2792643
Published Online: December 1, 1998
View Article titled, Potential Failure Sites in a Flip-Chip Package With and Without Underfill
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Topics: Failure, Flip-chip packages, Stress, Density, Finite element analysis
Journal Articles

The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints

S. Rzepka, M. A. Korhonen, E. Meusel, C.-Y. Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 342–348.
https://doi.org/10.1115/1.2792644
Published Online: December 1, 1998
View Article titled, The Effect of Underfill and Underfill Delamination on the Thermal Stress in Flip-Chip Solder Joints
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Topics: Delamination, Flip-chip, Solder joints, Thermal stresses, Solders, Stress, Adhesion, Damage, Failure, Finite element analysis
Journal Articles

Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses

J. Jiao, C. K. Gurumurthy, E. J. Kramer, Y. Sha, C. Y. Hui, P. Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 349–353.
https://doi.org/10.1115/1.2792645
Published Online: December 1, 1998
View Article titled, Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses
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Topics: Cantilever beams, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture toughness, Stress, Thermal stresses
Journal Articles

A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces

C. K. Gurumurthy, J. Jiao, L. G. Norris, C.-Y. Hui, E. J. Kramer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 372–378.
https://doi.org/10.1115/1.2792649
Published Online: December 1, 1998
View Article titled, A Thermo-Mechanical Approach for Fatigue Testing of Polymer Bimaterial Interfaces
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Topics: Fatigue testing, Polymers, Thermomechanics, Fracture (Materials), Displacement, Cycles, Fatigue, Cantilever beams, Delamination, Failure
Journal Articles

A New Approach to Calculate Atomic Flux Divergence by Electromigration

K. Sasagawa, N. Nakamura, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 360–366.
https://doi.org/10.1115/1.2792647
Published Online: December 1, 1998
View Article titled, A New Approach to Calculate Atomic Flux Divergence by Electromigration
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Topics: Electrodiffusion, Corners (Structural elements), Current density, Temperature, Computational methods
Journal Articles

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Z. Qian, M. Lu, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 145–149.
https://doi.org/10.1115/1.2792605
Published Online: June 1, 1998
View Article titled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity
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Topics: Modeling, Polymer films, Viscoelasticity, Viscoplasticity, Deformation, Stress, Chain, Constitutive equations, Drag (Fluid dynamics), Temperature effects
Journal Articles

An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages

H. C. Cheng, K. N. Chiang, M. H. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 129–134.
https://doi.org/10.1115/1.2792597
Published Online: June 1, 1998
View Article titled, An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages
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Topics: Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Solder joints
Journal Articles

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

J. Zhu, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 160–165.
https://doi.org/10.1115/1.2792609
Published Online: June 1, 1998
View Article titled, Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package
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Topics: Simulation, Thermal deformation, Finite element analysis, Diffraction patterns, Electronic packaging, Interferometry, Reliability, Temperature, Diffraction gratings, Displacement
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 156–159.
https://doi.org/10.1115/1.2792608
Published Online: June 1, 1998
View Article titled, A Review of Changes and Trends Affecting Military Electronics Manufacturing
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes
Journal Articles

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 171–174.
https://doi.org/10.1115/1.2792613
Published Online: June 1, 1998
View Article titled, Investigation of the Lead-On-Chip Package’s Reliability
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Journal Articles

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Y. Guo, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 186–193.
https://doi.org/10.1115/1.2792619
Published Online: June 1, 1998
View Article titled, Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications
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Topics: Electronic packaging, Event history analysis, Stress, Reliability, Failure, Packaging, Cycles, Design, Electronic packages, Electronic products
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
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Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 179–185.
https://doi.org/10.1115/1.2792617
Published Online: June 1, 1998
View Article titled, Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry
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Topics: Creep, Finite element methods, Flip-chip packages, Interferometry, Modeling, Deformation, Displacement, Solders, Stress, Finite element analysis
Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 141–144.
https://doi.org/10.1115/1.2792601
Published Online: June 1, 1998
View Article titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 118–122.
https://doi.org/10.1115/1.2792592
Published Online: June 1, 1998
View Article titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation