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Journal Articles

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
https://doi.org/10.1115/1.4062403
Published Online: May 15, 2023
View Article titled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
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Topics: Boilers, Boiling, Bose-Einstein condensates, Cooling, Fluids, Junctions, Slug flows, Temperature, Thermal resistance, Vehicles
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
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Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011108.
Paper No: EP-22-1030
https://doi.org/10.1115/1.4056412
Published Online: December 23, 2022
View Article titled, Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
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Topics: Batteries, Cycles, Lithium-ion batteries, Machine learning, Regression models, Reliability, Stress
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Article titled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
https://doi.org/10.1115/1.4056030
Published Online: November 23, 2022
View Article titled, Module-Level Thermal Interface Material Degradation in HALT
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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating
Includes: Supplementary data
Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Article titled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
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Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Article titled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer

J. C. C. Lo, Q. Jiang, X. Qiu, N. Tu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011103.
Paper No: EP-22-1013
https://doi.org/10.1115/1.4055840
Published Online: October 22, 2022
View Article titled, Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer
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Topics: High temperature, Inks, Reliability, Shear (Mechanics), Sintering, Storage, Solders, Additive manufacturing, Solder joints
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
https://doi.org/10.1115/1.4055394
Published Online: September 27, 2022
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
https://doi.org/10.1115/1.4054821
Published Online: August 3, 2022
View Article titled, The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods
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Topics: Algebra, Deformation, Differential equations, Genetic algorithms, Stress, Errors, Solders
Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

T.-C. Huang, K.-C. Liao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011206.
Paper No: EP-22-1010
https://doi.org/10.1115/1.4054822
Published Online: August 3, 2022
View Article titled, Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks
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Topics: Shock (Mechanics), Contact resistance, Displacement
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Han-Ling Li, Yang Shen, Yu-Chao Hua, S. L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011203.
Paper No: EP-22-1007
https://doi.org/10.1115/1.4054698
Published Online: July 13, 2022
View Article titled, Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs
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Topics: Diffusion (Physics), Gallium nitride, Heat, Heating, Modeling, Phonons, Simulation, Temperature, Heat conduction, Junctions
Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
https://doi.org/10.1115/1.4054462
Published Online: July 7, 2022
View Article titled, Electrothermal Analysis of System in Package for Aerospace Application
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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors
Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Michael Deckard, Darin J. Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011201.
Paper No: EP-21-1153
https://doi.org/10.1115/1.4054651
Published Online: July 7, 2022
View Article titled, Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat
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Topics: Heat, Phase change materials, Steady state, Temperature, Transients (Dynamics), Melting, Copper, Heat sinks, Tradeoffs, Simulation
Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
https://doi.org/10.1115/1.4054131
Published Online: April 22, 2022
View Article titled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature
Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021118.
Paper No: EP-21-1038
https://doi.org/10.1115/1.4053948
Published Online: March 28, 2022
View Article titled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks
Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
Open the PDF for Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias in another window
Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties