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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041019.
Paper No: EP-21-1161
https://doi.org/10.1115/1.4054263
Published Online: April 22, 2022
View Article titled, Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
Open the PDF for Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation in another window
Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications

Seung Kyu Oh, James Spencer Lundh, Shahab Shervin, Bikramjit Chatterjee, Dong Kyu Lee, Sukwon Choi, Joon Seop Kwak, Jae-Hyun Ryou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2019, 141(2): 020801.
Paper No: EP-18-1026
https://doi.org/10.1115/1.4041813
Published Online: February 25, 2019
View Article titled, Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
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Topics: Energy gap, Gallium nitride, Light-emitting diodes, Photonic equipment, Semiconductors (Materials), Temperature, Temperature measurement, Thermal management, Thermography, Automotive industry
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Article titled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Benjamin Giron-Palomares, Xin Fu, Abel Hernandez-Guerrero, Bladimir Ramos-Alvarado
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031008.
Paper No: EP-13-1114
https://doi.org/10.1115/1.4027378
Published Online: May 12, 2014
View Article titled, Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components
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Topics: Inspection, Solders, Thermography, Temperature, Ball-Grid-Array packaging
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection