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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. June 2023, 145(2): 021005.

Paper No: EP-22-1012

DOI: https://doi.org/10.1115/1.4055591

Published Online: September 28, 2022

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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems

Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis

J. Electron. Packag. March 2022, 144(1): 011003.

Paper No: EP-20-1083

DOI: https://doi.org/10.1115/1.4050696

Published Online: August 6, 2021

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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis

Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury

J. Electron. Packag. December 2020, 142(4): 041107.

Paper No: EP-19-1131

DOI: https://doi.org/10.1115/1.4047409

Published Online: June 26, 2020

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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)

Journal Articles

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Jie Liu, Jinglong Zou, Sheng Liu

J. Electron. Packag. March 2021, 143(1): 011003.

Paper No: EP-19-1078

DOI: https://doi.org/10.1115/1.4046762

Published Online: June 4, 2020

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Topics: Energy dissipation, Heat, Light-emitting diodes, Optimization, Phosphors, Temperature, Junctions, Natural convection, Thermal analysis, Fins

Journal Articles

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Ľuboš Černaj, Daniel Donoval, Jaroslav Kováč, Christian Dua, Sylvain L. Delage, Jean-Claude Jacquet

J. Electron. Packag. September 2019, 141(3): 031007.

Paper No: EP-18-1093

DOI: https://doi.org/10.1115/1.4043477

Published Online: May 17, 2019

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Topics: Gallium nitride, Heat, Simulation, Temperature, Transistors, Temperature distribution, Temperature measurement, Thermal properties, Gates (Closures), Thermal analysis

Journal Articles

Special Section on IMECE 2016

Justin A. Weibel, S. Ravi Annapragada

J. Electron. Packag. June 2017, 139(2): 020301.

Paper No: EP-17-1032

DOI: https://doi.org/10.1115/1.4036627

Published Online: June 12, 2017

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Topics: Failure analysis, Flexible electronics, Packaging, Reliability, Semiconductor wafers, Solders, Thermal analysis, Electronic packaging

Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain

J. Electron. Packag. June 2017, 139(2): 020908.

Paper No: EP-16-1140

DOI: https://doi.org/10.1115/1.4036404

Published Online: June 12, 2017

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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis

Journal Articles

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Takeru Kato, Ken Suzuki, Hideo Miura

J. Electron. Packag. June 2017, 139(2): 020911.

Paper No: EP-16-1144

DOI: https://doi.org/10.1115/1.4036442

Published Online: June 12, 2017

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Topics: Atoms, Copper, Current density, Diffusion (Physics), Electrodiffusion, Grain boundaries, Reliability, Temperature, Thin films, Heating

Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201.

Paper No: EP-16-1019

DOI: https://doi.org/10.1115/1.4032748

Published Online: March 10, 2016

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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards

Journal Articles

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Herman Oprins, Vladimir Cherman, Geert Van der Plas, Joeri De Vos, Eric Beyne

J. Electron. Packag. March 2016, 138(1): 010902.

Paper No: EP-15-1090

DOI: https://doi.org/10.1115/1.4032346

Published Online: March 10, 2016

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Topics: Energy dissipation, Experimental characterization, Heat transfer, Heating, Thermal conductivity, Thermal resistance, Thermal analysis, Cooling, Temperature, Temperature profiles

Journal Articles

Multiscale Transient Thermal Analysis of Microelectronics

Banafsheh Barabadi, Satish Kumar, Valeriy Sukharev, Yogendra K. Joshi

J. Electron. Packag. September 2015, 137(3): 031002.

Paper No: EP-13-1037

DOI: https://doi.org/10.1115/1.4029835

Published Online: September 1, 2015

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Topics: Microelectronic devices, Modeling, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Temperature distribution

Journal Articles

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Bengt Sundén, Gongnan Xie

J. Electron. Packag. June 2014, 136(2): 024501.

Paper No: EP-13-1058

DOI: https://doi.org/10.1115/1.4026538

Published Online: April 29, 2014

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Topics: Cooling, Heat, Heat sinks, Strips, Temperature, Thermal analysis, Thermal resistance, Electrical conductance, Invar, Temperature distribution

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

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Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

Jing He, Liping Liu, Anthony M. Jacobi

J. Electron. Packag. December 2011, 133(4): 041001.

DOI: https://doi.org/10.1115/1.4005299

Published Online: November 17, 2011

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Topics: Convection, Emissivity, Heat, Radiation (Physics), Temperature, Thermal analysis, Thermal conductivity, Heat transfer, Heat conduction, Flow (Dynamics)

Journal Articles

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Paolo Emilio Bagnoli, Cristina Padovani, Andrea Pagni, Giuseppe Pasquinelli

J. Electron. Packag. March 2011, 133(1): 011005.

DOI: https://doi.org/10.1115/1.4003516

Published Online: March 9, 2011

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Topics: Finite element methods, Stress, Temperature, Thermomechanics, Finite element analysis, Thermal analysis

Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

J. Electron. Packag. March 2011, 133(1): 011003.

DOI: https://doi.org/10.1115/1.4003217

Published Online: March 3, 2011

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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection

Journal Articles

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Yutaka Kumano, Tetsuyoshi Ogura, Toru Yamada

J. Electron. Packag. June 2009, 131(2): 021007.

DOI: https://doi.org/10.1115/1.3103947

Published Online: April 2, 2009

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Topics: Computational fluid dynamics, Junctions, Semiconductors (Materials), Temperature, Thermal conductivity, Modeling, Thermal analysis, Anisotropy

Journal Articles

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid

J. Electron. Packag. December 2008, 130(4): 041107.

DOI: https://doi.org/10.1115/1.2993132

Published Online: November 14, 2008

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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer

Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry

J. Electron. Packag. September 2007, 129(3): 256–259.

DOI: https://doi.org/10.1115/1.2753908

Published Online: April 16, 2007

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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability

Journal Articles

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

Tong Hong Wang, Chang-Chi Lee, Yi-Shao Lai, Yu-Cheng Lin

J. Electron. Packag. September 2006, 128(3): 281–284.

DOI: https://doi.org/10.1115/1.2229229

Published Online: October 7, 2005

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Topics: Boundary-value problems, Temperature, Thermal analysis, Transients (Dynamics), Vehicles, Finite element analysis, Junctions

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Journal citation

NARROW

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp

Advanced Characterization Techniques and Analysis of Thermal Properties of AlGaN/GaN Multifinger Power HEMTs on SiC Substrate Supported by Three-Dimensional Simulation

Special Section on IMECE 2016

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Effect of the Crystallinity on the Electromigration Resistance of Electroplated Copper Thin-Film Interconnections

Special Section on InterPACK 2015

Experimental Characterization of the Vertical and Lateral Heat Transfer in Three-Dimensional Stacked Die Packages

Multiscale Transient Thermal Analysis of Microelectronics

Thermal Analysis of Air-Cooled Electronic Units With Integrated Offset Strip-Fin Heat Sink

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Conjugate Thermal Analysis of Air-Cooled Discrete Flush-Mounted Heat Sources in a Horizontal Channel

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

High-Accuracy Thermal Analysis Methodology for Semiconductor Junction Temperatures by Considering Line Patterns of Three-Dimensional Modules

Compact Thermal Models: A Global Approach

Flexible Profile Compact Thermal Models for Practical Geometries

Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions

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