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Journal Articles

Introduction for JEP Special Issue on Carbon Nanotubes

Tarek Ragab, Dr., Cemal Basaran, Dr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
https://doi.org/10.1115/1.4004324
Published Online: July 1, 2011
View Article titled, Introduction for JEP Special Issue on Carbon Nanotubes
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Topics: Carbon nanotubes, Electronic packaging, Chirality, Electron field emission, Nanoelectronics, Strength (Materials)
Journal Articles

Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies

C. W. Tang, Y. C. Chan, K. C. Hung, P. L. Tu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 397–402.
https://doi.org/10.1115/1.1510865
Published Online: December 12, 2002
View Article titled, Correlation Between the Mechanical Strength and Curing Condition of No-Flow Flip Chip Assemblies
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Topics: Flip-chip devices, Flow (Dynamics), Shear strength, Tin, Heating, Flip-chip assemblies, Hardening (Curing), Solders, Manufacturing, Strength (Materials)
Journal Articles

Mechanics of Materials and Interfaces: The Disturbed State Concept

Chandrakant S. Desai,, Author, Antonio Gens,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2001, 123(4): 406.
https://doi.org/10.1115/1.1416148
Published Online: December 1, 2001
View Article titled, Mechanics of Materials and Interfaces: The Disturbed State Concept
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Topics: Civil engineering, Interface phenomena, Strength (Materials)
Journal Articles

A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints

Zequn Mei, Helen Holder
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 62–66.
https://doi.org/10.1115/1.2792133
Published Online: June 1, 1996
View Article titled, A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints
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Topics: Fatigue failure, Solder joints, Tin, Coatings, Failure, Agglomeration (Materials), Atoms, Cycles, Failure analysis, Melting
Journal Articles

Realistic Modeling of Edge Effect Stresses in Bimaterial Elements

J. W. Eischen, C. Chung, J. H. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1990, 112(1): 16–23.
https://doi.org/10.1115/1.2904333
Published Online: March 1, 1990
View Article titled, Realistic Modeling of Edge Effect Stresses in Bimaterial Elements
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Topics: Modeling, Stress, Aluminum, Elasticity, Strength (Materials), Design, Eigenfunctions, Electronics, Finite element analysis, Shear (Mechanics)